| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an image sensor module that makes the most of a dead space inside the module to contribute to miniaturization. <P>SOLUTION: The image sensor module includes: a first wiring board 10 which has a first face and a second face, and includes a first wiring pattern having a first land on the first face side; a solid-state image sensor chip 30 which has a functional face having a light receiving unit and a non-light receiving unit including a terminal pad, and is provided on the first wiring board with this functional face being directed to the opposite side to the first wiring board side; a second wiring board 20 which has a first face and a second face, includes a second wiring pattern having a second land on the first face side, and is provided on the non-light receiving unit of the solid-state image sensor chip with the second face side being directed to the solid-state image sensor chip side; and bonding wires 41 and 42 for electrically connecting a terminal pad of the solid-state image sensor chip with the first land of the first wiring board and/or the second land of the second wiring board. <P>COPYRIGHT: (C)2010,JPO&INPIT |
