发明名称 SUBSTRATE SUPPORT TABLE OF PLASMA PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate support table of a plasma processing device that stably controls a substrate at relatively high temperature. <P>SOLUTION: The substrate support table includes: an electrostatic attraction plate 14 incorporating a first electrode for electrostatically attracting the substrate W, a second electrode for applying a bias to the substrate W and a heater for heating the substrate; a cylindrical flange 13 welded to a lower surface of the electrostatic attraction plate 14 and made of an alloy having thermal characteristics similar to those of the electrostatic attraction plate 14; and a support table 10 which has an O ring 12 on a surface opposed to a lower surface of the flange 13 and to which the flange 13 is fitted with the O ring 12 interposed. When bias power applied to the substrate W is changed, heater power for heating the substrate W is changed so that the temperature of the substrate W becomes constant. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010199107(A) 申请公布日期 2010.09.09
申请号 JP20090038820 申请日期 2009.02.23
申请人 MITSUBISHI HEAVY IND LTD 发明人 KAFUKU HIDENARU;MATSUKURA AKIHIKO;YANAGIDA HISASHI
分类号 H01L21/683;C23C16/458;H01L21/205;H01L21/3065;H05H1/46 主分类号 H01L21/683
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