| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device and soldering method, which improve the adhesion between an electronic component and a substrate, and to readily remove the electronic component after soldering. SOLUTION: The soldering device inserts leads of the electronic component from the surface side of the substrate to holes formed in the substrate for soldering the leads from a rear surface side of the substrate. The device is provided with: a support stand 2 for supporting the substrate, while directing the backside upward; a housing hole 4, formed in the support stand 2 to house the electronic component projecting from the surface of the substrate; an elastic member 5 for energizing the electronic component housed in the housing hole 4 upward, and energizing so as to make the surface of the substrate slightly apart from the support stand 2; and a pressing member 6 for pressing the substrate slightly apart from the support stand 2 to the support stand 2, against the elastic member 5, in such a state that the electronic component is brought into close contact with the surface of the substrate. COPYRIGHT: (C)2010,JPO&INPIT |
