| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum treatment apparatus responding to addition and change of a control device without changing a structure and position of an input/output substrate. SOLUTION: A first interface which occupies transmission and reception of a signal between a module controller 113 and the first interface by a communication program 506 of a module controller 113 and a communication program 601 of the input/output substrate 201, and a second interface connected to a device to be controlled in a treatment chamber by the communication program 601 of the input/output substrate 201 are provided in treating a wafer arranged in the treatment chamber of the vacuum treatment apparatus by transmitting and receiving a control signal between the module controller 113 and input/output substrate 201. The input/output substrate 201 receives an operation command signal of the device to be controlled by the first interface, and transmits the received operation command signal on the device to be controlled through the second interface. COPYRIGHT: (C)2010,JPO&INPIT |
