| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a both-sided flexible wiring board which allows soldering technique to be applied to, especially, interlayer connection and is suitable to mass-production. Ž<P>SOLUTION: The method of manufacturing the both-sided flexible wiring board includes the steps of: forming first and second circuit wiring layers 2a, 3a which is provided across both surfaces of a flexible insulating substrate 1a and patterned to form a unit pair; coating a surface of at least the first circuit wiring layer 2a with a mask layer M1 for soldering; forming a through hole H penetrating the insulating substrate 1a and the respective layers; and causing molten solder 6 to flow into the through hole H and filling it to form an interlayer conductive via V interconnecting the first and second circuit wiring layers. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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