| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package, in which a bump can be prevented from tilting by suppressing the pulling of the bump by an inner lead resulting from a difference in thermal shrinkage quantity. SOLUTION: A base film 12 and a silicon material constituting a semiconductor chip 26 are differed in shrinkage quantity in cooling since the both are differed in thermal expansion coefficient. Thus, the base film shrinks more than the semiconductor chip 26, whereby an inner lead 18 is pulled by the base film 12, and a metal bump 32 connected to the inner lead 18 is also pulled. This may cause tilting of the metal bump 32. However, a reinforcing bump 40 is provided separately from the metal bump 32, whereby two metal joint parts can be ensured between one inner lead 18 and the semiconductor chip 26. Therefore, the tensile force acting on the metal bump 32 can be dispersed to the reinforcing bump 40 to prevent the metal bump 32 from tilting. COPYRIGHT: (C)2010,JPO&INPIT |
