| 摘要 |
PURPOSE: A circuit board for the heat dissipation of an LED and a manufacturing method thereof are provided to improve the efficiency of light emitted from an LED chip by efficiently discharging heat energy from an LED chip. CONSTITUTION: A metal wiring comprises a bonding pad mounting an LED chip and a circuit for driving an LED chip. A circuit board base(11) made of a metal material like AL is provided. An anodized aluminum oxide layer is formed on the base. A sealing layer fills a gap or crack of the anodized aluminum oxide layer and is formed on the anodized aluminum oxide layer. A seed layer(221) is formed on the sealing layer for a metal wiring. A plating layer(223) is formed on the metal wiring of the seeding layer.
|
