发明名称 |
SUBSTRATE DICING SYSTEM, SUBSTRATE MANUFACTURING APPARATUS, AND SUBSTRATE DICING METHOD |
摘要 |
<p>The objective of the present invention is to make an entire system compact and provide a substrate cutting system capable of efficiently cutting a variety of substrates. A substrate cutting system according to the present invention includes: pair of scribing line forming means arranged facing each other; pair of scribing devices for supporting the pair of scribing forming line means such that one of the pair of scribing forming line means moves on a first surface of a substrate in an X axial direction and the other of the pair of scribing forming means moves on a second surface of the substrate in the X axial direction; a scribing device guide body for supporting the pair of scribing devices such that the pair of scribing devices moves in a Y axial direction; and a substrate supporting means for supporting the substrate in an X-Y plane such that the pair of scribing forming line means scribes the first surface of the substrate and the second surface of the substrate.</p> |
申请公布号 |
EP1666221(A4) |
申请公布日期 |
2010.09.08 |
申请号 |
EP20040788121 |
申请日期 |
2004.09.24 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. |
发明人 |
NISHIO, YOSHITAKA;OKAJIMA, YASUTOMO;OSHIMA, YUKIO;ONARI, HIROYUKI;YOSHIMOTO, KAZUHIRO |
分类号 |
B28D5/00;B28D1/22;B28D7/04;B65G49/06;C03B33/027;C03B33/03;C03B33/033 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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