Solid-state image pickup element, method of manufacturing the same, and electronic apparatus using the same

摘要

Disclosed herein is a solid-state image pickup element (10), including a plurality of pixels (12) each having a photoelectric conversion portion (PD) for converting a quantity of incident light into an electric signal, and a plurality of pixel transistors (Tr); wiring layers (31,33,34) formed on one surface side of a semiconductor substrate (30) having the plurality of pixels (12) formed therein, a light made incident from a side opposite to the one surface having the wiring layers (31,33,34) formed thereon being received by corresponding one of the photoelectric conversion portions (PD); a scribe line (20) formed in a periphery of a pixel portion (13) composed of the plurality of pixels (12); and square-shaped termination detecting portions (21) each having higher hardness than that of the semiconductor substrate (30) and formed in the scribe line (20); wherein each of the square-shaped termination detecting portions (21) has a side parallel with a direction of the scribe line (20) of the semiconductor substrate (30).