| 摘要 |
A thermal conduction structure for heat generating components includes a heat conduction base 10, a heat conduction module 20 having a plurality of heat columns 21 installed on the heat conduction base 10, and a plurality of heat generating components 30 installed on a distal surface of the heat column 21. Each heat column 21 includes at least one heat generating component 30, and heat produced by the heat generating components 30 is passed from the heat column 21 to the heat conduction base 10 for shunting, conducting and dissipating the heat, such that the heat produced by the heat generating component 30 can be conducted, shunted and dissipated quickly to achieve an excellent thermal conduction effect to prevent a high-heat area or a thermal interference area formed on an installation surface of the heat generating component 30, so as to assure a normal operation and a long using life of the heat generating components 30. |
