发明名称 BACKPLANE STRUCTURES FOR ELECTRONIC DEVICES
摘要 There is provided a backplane for an organic electronic device including a TFT substrate having a base substrate, a polysilicon layer, a gate dielectric layer, a gate electrode, an interlayer dielectric, and a data electrode; an insulating layer over the TFT substrate; a multiplicity of first openings in the insulating layer having a depth d1; a multiplicity of pixelated diode electrode structures, wherein a first set of diode electrode structures are in the first openings; and a bank structure defining pixel areas over the diode electrode structures; wherein the first openings and first set of diode electrode structures are in at least a first set of the pixel areas.
申请公布号 EP2225776(A1) 申请公布日期 2010.09.08
申请号 EP20080862732 申请日期 2008.12.11
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 TSAI, YAW-MING, A.;PARKER, IAN, D.;MEINEL, INES
分类号 H01L23/48;H01L27/32;H01L51/52 主分类号 H01L23/48
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