| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can provide a larger number of terminals without increasing its size, and can secure a required number of terminals with smaller sizes, and to provide a packaging structure of the semiconductor device. <P>SOLUTION: In the semiconductor device 1, a semiconductor chip 2 is connected to an interposer 3. The interposer 3 has an external connection terminal comprising a terminal 4 for packaging used for connection with a printed-wiring board 9, and a terminal 5 for measurement used for testing the semiconductor chip 2 electrically. The terminal 4 for packaging is arranged at the periphery of the interposer 3, and at least one portion of the terminal 5 for measurement is arranged in the terminal 4 for packaging. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
