发明名称 Semiconductor device, method of manufacturing the same, and method of manufacturing metal compound thin film
摘要 A method of manufacturing a metal compound thin film is disclosed. The method may include forming a first metal compound layer on a substrate by atomic layer deposition, performing annealing on the first metal compound layer in an atmosphere containing a nitrogen compound gas, thereby diffusing nitrogen into the first metal compound layer, and forming a second metal compound layer on the first metal compound layer by atomic layer deposition.
申请公布号 US7790627(B2) 申请公布日期 2010.09.07
申请号 US20070001381 申请日期 2007.12.11
申请人 ROHM CO., LTD. 发明人 IWAMOTO KUNIHIKO;NABATAME TOSHIHIDE;TOMINAGA KOJI;YASUDA TETSUJI
分类号 H01L21/318;H01L21/8242;H01L21/28;H01L21/302;H01L21/461;H01L21/469;H01L21/4763;H01L29/51;H01L29/78 主分类号 H01L21/318
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