发明名称 Memory integrated circuit device providing improved operation speed at lower temperature
摘要 A memory integrated circuit device may include a first temperature sensing unit, a first voltage adjusting unit, and a MOS back bias voltage outputting unit. The first voltage adjusting unit may be configured to output a voltage based on an output signal of the temperature sensing unit such that the voltage output changes based on changes in a sensed temperature. The MOS back bias voltage outputting unit may be configured to receive the voltage output by the voltage adjusting unit and configured to output the MOS back bias voltage based on the voltage output by the first voltage adjusting unit.
申请公布号 US7791959(B2) 申请公布日期 2010.09.07
申请号 US20070708321 申请日期 2007.02.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHUN KI-CHUL
分类号 G11C5/14 主分类号 G11C5/14
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