| 摘要 |
An integrated circuit chip and a method of fabricating an integrated circuit chip. The integrated circuit chip includes: a set of wiring levels stacked from a first wiring level to a last wiring level; and a respective void in each wiring level of two or more wiring levels of the set wiring levels, each respective void extending in a continuous ring parallel and proximate to a perimeter of the integrated circuit chip, a void of a higher wiring level stacked directly over but not contacting a void of a lower wiring level, the respective voids forming a crack stop.
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