发明名称 FOLDED EXPAND-ON-SITE PAPER PACKAGING
摘要 A series of interconnected packing chip precursors (5A) that are formed and transported economically to a packager as a flat sheet and then expanded at the site where they will be used as individual packing chips by folding and separating from the other chips. The precursors are formed on a chipboard sheet by forming fold lines (10), separation lines (16) and adding securing means such as bonding media )19) or connecting features to secure the sides of the expanded packing chip in its final shape. The fold lines (10) and separation lines (16) can be configured to form jagged or serrated edges (8W, 8X) on the expand-on-site packing chip, and the chip may also include apertures (40); the jagged and serrated edges (8W, 8X, 8Y, 8Z) and the apertures (40) cooperating with each other and other aspects of adjacent chips to interlock the chips when they are placed around an item in a package for shipment.
申请公布号 CA2430602(C) 申请公布日期 2010.09.07
申请号 CA20012430602 申请日期 2001.11.29
申请人 GOERS, JOHN L.;OLIVER, WILLIAM H. 发明人 GOERS, JOHN L.;OLIVER, WILLIAM H.
分类号 B31B1/08;B29D22/00;B29D23/00;B32B3/12;B65D5/50;B65D65/12;B65D65/14;B65D65/28;B65D65/30;B65D81/09;D02G3/00;G09F3/00 主分类号 B31B1/08
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