发明名称 |
Observation apparatus and method for observing void in underfill resin |
摘要 |
A disclosed observation apparatus for observing a void generated in an underfill resin upon mounting a body to be mounted on a substrate via the underfill resin in flip-chip mounting includes: a mounting unit mounting the body to be mounted on the substrate; and an observation unit observing behavior of the underfill resin while the mounting unit is mounting the body to be mounted on the substrate.
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申请公布号 |
US7790499(B2) |
申请公布日期 |
2010.09.07 |
申请号 |
US20070877051 |
申请日期 |
2007.10.23 |
申请人 |
FUJITSU LIMITED |
发明人 |
SATO MASAHIKO;IKURA KAZUYUKI;NISHINO TORU |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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