发明名称 Semiconductor light emitting device and method of manufacturing the same
摘要 A method of manufacturing a semiconductor light emitting device. The method includes: mounting a semiconductor light emitting element on a flat substrate; covering the semiconductor light emitting element on the flat substrate by a cover layer in a domed shape to form a light emitting device, the cover layer including at least a phosphor layer and a coating resin layer that are laminated in order, so as to fill around the semiconductor light emitting element; measuring an emission condition of the light emitting device; and forming a convex lens unit on the outermost of the coating resin layer using a liquid droplet discharging apparatus to adjust an emission distribution of the light emitting device based on the measured emission condition.
申请公布号 US7790485(B2) 申请公布日期 2010.09.07
申请号 US20080122446 申请日期 2008.05.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NOMURA YUKO;MORI KENICHI;TAKASU ISAO;SUGI KEIJI;AMEMIYA ISAO;YODA MIHO
分类号 H01L21/00;H01L33/62;H01L33/50;H01L33/54;H01L33/56 主分类号 H01L21/00
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