发明名称 |
Semiconductor light emitting device and method of manufacturing the same |
摘要 |
A method of manufacturing a semiconductor light emitting device. The method includes: mounting a semiconductor light emitting element on a flat substrate; covering the semiconductor light emitting element on the flat substrate by a cover layer in a domed shape to form a light emitting device, the cover layer including at least a phosphor layer and a coating resin layer that are laminated in order, so as to fill around the semiconductor light emitting element; measuring an emission condition of the light emitting device; and forming a convex lens unit on the outermost of the coating resin layer using a liquid droplet discharging apparatus to adjust an emission distribution of the light emitting device based on the measured emission condition.
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申请公布号 |
US7790485(B2) |
申请公布日期 |
2010.09.07 |
申请号 |
US20080122446 |
申请日期 |
2008.05.16 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NOMURA YUKO;MORI KENICHI;TAKASU ISAO;SUGI KEIJI;AMEMIYA ISAO;YODA MIHO |
分类号 |
H01L21/00;H01L33/62;H01L33/50;H01L33/54;H01L33/56 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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