发明名称 |
Multi-layer embedded capacitance and resistance substrate core |
摘要 |
A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
|
申请公布号 |
US7791897(B2) |
申请公布日期 |
2010.09.07 |
申请号 |
US20080283146 |
申请日期 |
2008.09.09 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
DAS RABINDRA N.;LAUFFER JOHN M.;MEMIS IRVING;ROSSER STEVEN G. |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|