发明名称 Defect review using image segmentation
摘要 One embodiment pertains to a method for reviewing a potential defect on a substrate from one electron image. An image of an area containing the potential defect is obtained using a charged-particle apparatus. At least three image segments within the image are determined. The three segments are transformably identical to each other, and one of said three segments includes the potential defect. Another embodiment pertains to a method for reviewing a potential defect on a substrate by obtaining an electron-beam image of a relatively large field of view containing a first image segment. The first image segment is substantially smaller than the field of view and includes a location of the potential defect. A comparison image segment within the field of view is determined. The comparison image segment is transformably identical to the first image segment. Other embodiments and features are also disclosed.
申请公布号 US7792351(B1) 申请公布日期 2010.09.07
申请号 US20100710076 申请日期 2010.02.22
申请人 KLA-TENCOR TECHNOLOGIES CORPORATION 发明人 TOTH GABOR D.;MASNAGHETTI DOUGLAS K.
分类号 G06K9/00 主分类号 G06K9/00
代理机构 代理人
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