CIRCUIT SUBSTRATE HAVING CIRCUIT WIRE, METHOD OF MANUFACTURING THE CIRCUIT SUBSTRATE, AND SEMICONDUCTOR PACKAGE HAVING THE CIRCUIT WIRE

摘要

The invention discloses a circuit substrate and its formation method and semiconductor encapsulation. The circuit substrate includes a substrate body having a first terminal and a second terminal separated from the first terminal. A circuit wire includes a wiring unit for electrically connecting the first and second terminals by electrically connecting conductive polarization particles that include a first polarity and a second polarity that is opposite to the first polarity. The circuit wire also includes an insulation unit for insulating the wiring unit.