发明名称 HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME
摘要 <p>PURPOSE: A heat conducting slug having multi-step structure and a light emitting diode package using the same are provided to prevent the separation of a heat transmission slug from housing by combining support leads or the lead terminals with the heat transmission slug. CONSTITUTION: In a device, a heat transmission slug of a multi level structure includes a first slug(110), a second slug(120), and a third slug(130). The second slug is arranged on the first slug, and the third slug is arranged on the second slug. A first slug having the form of a cylinder is installed within the light-emitting diode package having a circular shape. The second slug and the third slug are arranged to be 45 crossly in order to maximize a heat emitting effect. A light emitting diode(10) is installed within the third slug.</p>
申请公布号 KR100979700(B1) 申请公布日期 2010.09.03
申请号 KR20090118265 申请日期 2009.12.02
申请人 发明人
分类号 H01L33/64 主分类号 H01L33/64
代理机构 代理人
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