| 发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE FOR VERTICAL MOUNT AND METHOD |
| 摘要 |
<p>In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.</p> |
| 申请公布号 |
HK1106614(A1) |
申请公布日期 |
2010.09.03 |
| 申请号 |
HK20070111841 |
申请日期 |
2007.11.01 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES L.L.C. |
发明人 |
STEPHEN ST. GERMAIN;FRANCIS J. CARNEY;BRUCE A. HULING |
| 分类号 |
H01L |
主分类号 |
H01L |
| 代理机构 |
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| 地址 |
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