发明名称 LIGHT EMITTING PACKAGE CONTROLLING COLOR TEMPERATURE, FABRICATING METHOD THEREOF, COLOR TEMPERATURE CONTROLLING METHOD OF LIGHT EMITTING PACKAGE
摘要 PURPOSE: A light emitting package controlling color temperature, a fabricating method thereof, and a color temperature controlling method of light emitting package are provided to control the color temperature of the light emitting package by laser trimming the thin film resistance. CONSTITUTION: A first electrode(51) and a second electrode(52) are formed in the package body(10). A light emitting device(100) is electrically connected to the first electrode and the second electrode. A thin film resistor(90) is serially connected to the first electrode. A resin layer(70) is formed in order to fill a groove(12) on a fluorescent layer(60).
申请公布号 KR20100097434(A) 申请公布日期 2010.09.03
申请号 KR20090016371 申请日期 2009.02.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, YU SIK
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
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