发明名称 |
LIGHT EMITTING PACKAGE CONTROLLING COLOR TEMPERATURE, FABRICATING METHOD THEREOF, COLOR TEMPERATURE CONTROLLING METHOD OF LIGHT EMITTING PACKAGE |
摘要 |
PURPOSE: A light emitting package controlling color temperature, a fabricating method thereof, and a color temperature controlling method of light emitting package are provided to control the color temperature of the light emitting package by laser trimming the thin film resistance. CONSTITUTION: A first electrode(51) and a second electrode(52) are formed in the package body(10). A light emitting device(100) is electrically connected to the first electrode and the second electrode. A thin film resistor(90) is serially connected to the first electrode. A resin layer(70) is formed in order to fill a groove(12) on a fluorescent layer(60). |
申请公布号 |
KR20100097434(A) |
申请公布日期 |
2010.09.03 |
申请号 |
KR20090016371 |
申请日期 |
2009.02.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, YU SIK |
分类号 |
H01L33/48;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|