ADHESIVE COMPOSITION, ADHESIVE SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition that can achieve a high package reliability such that neither separation at adhesive interface nor package crack develops in a package in which a semiconductor chip is mounted even when exposed to severe reflow conditions. SOLUTION: The adhesive composition includes an energy ray-curable pressure-sensitive adhesive component, a photopolymerization initiator and a thermosetting adhesive component. The photopolymerization initiator has a weight average molecular weight of 400-100,000. COPYRIGHT: (C)2010,JPO&INPIT