| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a thermoelectric conversion module that can suppress a void and a wetting defect due to damage to a nickel plating layer. SOLUTION: The substrate for the thermoelectric conversion module is mounted with a thermoelectric semiconductor device and has a plurality of first metal deposition layers formed on a top surface of the substrate and a second metal deposition layer formed on a reverse surface of the substrate. The substrate includes a ceramic plate, an organic film, or a combination of the ceramic plate and organic film, and the plurality of first metal deposition layers or the second metal deposition layer has the nickel plating layer and a Pd layer or Pt layer formed in contact with the nickel plating layer. COPYRIGHT: (C)2010,JPO&INPIT |
