| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for polishing which exhibits excellent polishing performance and minimizes degradation in a polishing rate even if used for long-term polishing. SOLUTION: In the composition for polishing, a spherical silica particle the sphericity of which is 0.9 or larger and 1.0 or smaller, and a non-spherical particle the sphericity of which is 0.3 or larger and less than 0.9 are dispersed in a water-based dispersive medium, and the weight ratio of the spherical particle to the non-spherical particle ranges from 2/98 to 35/65. The average grain size of the spherical particle ranges from 20 to 150 nm, and that of the non-spherical particle ranges from 5 to 100 nm. COPYRIGHT: (C)2010,JPO&INPIT |
