DEVICE AND METHOD FOR MEASURING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a device and method for measuring a semiconductor wafer. SOLUTION: The device 2 for measuring the semiconductor wafer includes a measurement stage 2 on which the semiconductor wafer W is mounted and a probe needle 3 to be brought into contact with the semiconductor wafer W from an upper surface side of the measurement stage 2, stray capacity generated between the probe needle 3 and measurement stage 2 is reduced by setting the area of an electrode part 4 of the measurement stage 2 to 10 to 150 mm2and making the area of the electrode part 4 smaller than the area of the semiconductor wafer W. COPYRIGHT: (C)2010,JPO&INPIT