发明名称 |
Biochip |
摘要 |
To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.
|
申请公布号 |
US2010222226(A1) |
申请公布日期 |
2010.09.02 |
申请号 |
US20040572332 |
申请日期 |
2004.09.17 |
申请人 |
ISHIHARA KAZUHIKO;FUNAOKA SOHEI;YOKOYAMA KANEHISA |
发明人 |
ISHIHARA KAZUHIKO;FUNAOKA SOHEI;YOKOYAMA KANEHISA |
分类号 |
C40B30/04;C12Q1/00;C40B40/08;C40B40/10;C40B40/12;C40B50/18;C40B60/12;C40B99/00;G01N33/53;G01N37/00 |
主分类号 |
C40B30/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|