DUAL OVENABLE FOOD PACKAGE HAVING A THERMOFORMABLE POLYESTER FILM LID

摘要

The invention provides an ovenable vacuum skin package for storage and cooking of a food product. The package includes a receptacle and a thermoformable composite polymeric film cover heat-sealed thereto, and the composite polymeric film cover includes: (i) a thermoformable substrate layer comprising a first copolyester material; and (ii) on a surface of the substrate layer, a heat-sealable layer comprising a second copolyester material, the second copolyester material being different from the first copolyester material; wherein i. the receptacle comprises on a surface thereof a sealing region adapted to contact and form a scal with the heat-sealable layer; and ii. both the receptacle and the cover film comply with the requirements of paragraph h(1) of CFR §177.1630.