| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the yield of lids while ensuring shielding effects to semiconductor chips in packages, where the semiconductor chips are disposed in hollow cavities comprising mold substrates and the lids. <P>SOLUTION: The hollow cavity S1 is formed by covering an upper surface 7a of the mold substrate 7 that includes a lower shield plate 15 and a support lead formed integrally, and mounts a semiconductor chip by a closed-end cylindrical mold lid 9 obtained by sealing an upper shield plate 41 disposed opposite to the lower shield plate 15 and a connection bar 43 abutting on the support lead extended integrally from the periphery of the upper shield plate 41 with a second closed-end cylindrical mold resin material 45. Also, an opening end 53a of the second mold resin material 45 is allowed to abut inside the periphery of the upper surface 7a of the mold substrate 7, and a third mold resin material 61 is stuck over the upper surface 7a of the mold substrate 7 positioned outside the cavity S1 and the external surface of the mold lid 9. <P>COPYRIGHT: (C)2010,JPO&INPIT |
