| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve an EMC problem by improving signal integrity of a switching mode electric circuit including a digital circuit. <P>SOLUTION: Conductor foil 71 including a negative electrode terminal part 76 is stuck to a strip conductor layer 78 of a microstrip line structure 73, 77 having a conductive polymer layer and a carbon graphite layer laminated on both surfaces of etched chemically-processed foil, a strip conductor layer 78 and the plane conductor layer 79; conductor foil 75 including positive electrode terminal parts 72, 74 is stuck to a plane conductor layer 79 of the microstrip line structure 73, 77; and thereby a basic structure of a low impedance loss line component is formed. The low impedance loss line component is formed by armoring the basic structure with a resin. The low impedance loss line component of which the line length and the quantity of use are determined at optimum values is mounted in the vicinity of a semiconductor integrated circuit or a switching element, and connected in series to a power line or in parallel to a ground plane. <P>COPYRIGHT: (C)2010,JPO&INPIT |
