| 摘要 |
PROBLEM TO BE SOLVED: To provide a debonding apparatus that prevents the concentration of excessive load on one part of a chip when debonding an electronic component from an adhesive sheet and thereby prevents cracking of the electronic component. SOLUTION: There is provided the debonding apparatus for debonding a thin plate-like electronic component 21 pasted on an adhesive sheet. The debonding apparatus includes a first push-up means 3 with a push-up surface 10 having a smaller outer shape than an electronic component 21, a second push-up means 4 with a plurality of pin members 9, a first driving mechanism 5 for moving the push-up surface 10 up and down, a second driving mechanism 6 for moving the pin members 9 up and down, and a control means 50. After initial debonding wherein the peripheral edge of the electronic component 21 is debonded by pushing up the electronic component 21 from below via the adhesive sheet 20 by means of the push-up surface 10 and the pin members 9 or by means of only the push-up surface 10, the control means controls the first driving mechanism 5 and the second driving mechanism 6 so as to accelerate the debonding of the electronic component 21 by locating the tips of the pin members 9 above the push-up surface 10. COPYRIGHT: (C)2010,JPO&INPIT |
