| 摘要 |
<P>PROBLEM TO BE SOLVED: To incorporate various features to protect MEMS elements from being damaged by external force in association with packaging of the MEMS devices. Ž<P>SOLUTION: A packaged device includes a substrate 101, an interferometric modulation display array 111 formed on the substrate 101, and a backplate 121. The backplate is placed over the display array 111 with a gap 124 between the backplate and the display array. The depth of the gap may vary across the backplate. The backplate can be curved or have a recess on its interior surface facing the display array. Thickness of the backplate may vary. The device may include a reinforcing structure which is integrated with the backplate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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