HEAT SINK AND MOTHERBOARD ASSEMBLY UTILIZING THE HEAT SINK

摘要

A heat sink to dissipate heat for a motherboard includes a main body, and a fixing device. The main body includes a number of fins. The fixing device includes a fixing portion connected to a bottom of the main body, and two grounding pins extending from a bottom of the fixing portion, to engage in two idle grounding holes of the motherboard. A motherboard assembly utilizing the heat sink is also provided.