| 摘要 |
<p>PURPOSE: A stack package and a method of fabricating the same are provided to prevent the reliability deterioration of work by preventing the increase in the height of a whole package. CONSTITUTION: A first semiconductor chip(108) is attached on a substrate(102) to a flip-chip mode. A second semiconductor chip(116) is attached on the first semiconductor chip face-up. An encapsulating unit(126) seals the top side of the substrate including the first and second semiconductor chips, and includes a first hole, a second hole, and a trench connecting the first and second holes. An interconnection(104) is formed within the first and second holes and the trench.</p> |
