DIRECT-CONNECT SIGNALING SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide an interconnect structure for high-speed signal processing of a semiconductor integrated circuit package.

SOLUTION: The direct-connect signaling system 200 includes a printed circuit board 205 and first (201A) and second (201B) integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors 203 extend between the first and second integrated circuit packages, suspended above the printed circuit board. By this structure, parasitic capacitance and signal reflection generated from structures (for instance, a conductive via or the like) of the entrance and the exit of the printed circuit board are prevented.

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