发明名称 WIRING BOARD WITH REINFORCING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board with a reinforcing material, which prevents warpage of a wiring board by surely reducing stress applied to a reinforcing material. <P>SOLUTION: The wiring board 11 with a reinforcing material includes a wiring board 40 and a stiffener 31. The wiring board 40 has a substrate main surface 41 and a substrate rear surface 42 and is formed by laminating a plurality of resin insulating layers 43-46 and a plurality of conductor layers 51, without including a core substrate. The stiffener 31 has a rectangular-frame shape and includes four divided pieces 36. Each divided piece 36 is divided via a slit 39 extending from the frame inner surface 37 to the frame outer surface 38. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010192546(A) 申请公布日期 2010.09.02
申请号 JP20090033314 申请日期 2009.02.16
申请人 NGK SPARK PLUG CO LTD 发明人 ASANO TOSHIYA;MAEDA SHINNOSUKE
分类号 H05K1/02 主分类号 H05K1/02
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