摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board with a reinforcing material, which prevents warpage of a wiring board by surely reducing stress applied to a reinforcing material. <P>SOLUTION: The wiring board 11 with a reinforcing material includes a wiring board 40 and a stiffener 31. The wiring board 40 has a substrate main surface 41 and a substrate rear surface 42 and is formed by laminating a plurality of resin insulating layers 43-46 and a plurality of conductor layers 51, without including a core substrate. The stiffener 31 has a rectangular-frame shape and includes four divided pieces 36. Each divided piece 36 is divided via a slit 39 extending from the frame inner surface 37 to the frame outer surface 38. <P>COPYRIGHT: (C)2010,JPO&INPIT |