| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic package substrate with high airtightness using a ceramic substrate. <P>SOLUTION: The ceramic package substrate 100 includes a ceramic base 10, a laminated ceramic frame 20 formed by laminating and burning a plurality of ceramic green sheets and arranged in a frame shape on an upper surface of the ceramic base, and metal wiring 30 extending between different layers of the laminated ceramic frame 20 to link the inside and outside of the laminated ceramic frame 20 to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
