发明名称 COOLING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure which is inexpensive, has improved efficiency of cooling, and is easily processed. SOLUTION: The cooling structure 20 is arranged in a housing 10 and cools the housing 10. The cooling structure 20 includes: an outer surface panel 21; a liquid cooling pipe 24 which has a surface contact part 24a sandwiched between the outer surface panel 21 and a side surface 10b of the housing 10 and coming in surface contact with each of the outer surface panel 21 and side surface 10b, and cools the housing 10 with a cooling medium flowing in the liquid cooling pipe through the surface contact part 24a and side surface 10b; and a contact fixing part 25 which fixes the outer surface panel 21 to the housing 10 so as to bring the outer surface panel 21, side surface 10b, and liquid cooling pipe 24 into close contact with one another. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010192602(A) 申请公布日期 2010.09.02
申请号 JP20090034101 申请日期 2009.02.17
申请人 GOYO ELECTRONICS CO LTD 发明人 YASUDA TAKASHI;KOBAYASHI MASAHIKO
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址