发明名称 RESIN COMPOSITION AND MULTILAYER STRUCTURE USING SAME
摘要 Provided is a resin composition including a polyolefin (A), a saponified ethylene-vinyl acetate copolymer (EVOH) (B) having an ethylene content of 20-65 mol% and having vinyl acetate units with a degree of saponification of 96% or more, a C8-22 metal salt of a higher fatty acid (C), a conjugated polyene compound (D) having a boiling point of 20? or higher, an ethylene-vinyl acetate copolymer (E), and a saponified ethylene-vinyl acetate copolymer (F) having an ethylene content of 68-98 mol% and having vinyl acetate units with a degree of saponification of 20% or more, and wherein the mass ratio (A:B) of the polyolefin (A) and the EVOH (B) is 60:40-99.9:0.1. The resin composition contains 0.0001-10 parts by mass of the metal salt of a higher fatty acid (C), 0.000001-1 parts by mass of the conjugated polyene compound (D), and a total of 0.3 or more parts by mass of the ethylene-vinyl acetate copolymer (E) and the saponified ethylene-vinyl acetate copolymer (F) combined, per a total of 100 parts by mass of the polyolefin (A) and EVOH (B) combined. As a result, when melt-molding the resin composition comprising of the polyolefin (A) and the EVOH (B), defects in the appearance of the molded product that result from poor dispersion of the EVOH (B) can be improved.
申请公布号 WO2010079851(A3) 申请公布日期 2010.09.02
申请号 WO2010JP55594 申请日期 2010.03.29
申请人 KURARAY CO., LTD.;KAZETO, OSAMU 发明人 KAZETO, OSAMU
分类号 C08L23/00;C08J3/22;C08K5/01;C08K5/098;C08L29/04;C08L31/04 主分类号 C08L23/00
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