| 发明名称 |
THERMALLY CONDUCTING FOAM INTERFACE MATERIALS |
| 摘要 |
In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film. |
| 申请公布号 |
US2010218932(A1) |
申请公布日期 |
2010.09.02 |
| 申请号 |
US20100778510 |
申请日期 |
2010.05.12 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
FISCHER PATRICK J.;KOBE JAMES J.;MURRAY CAMERON T. |
| 分类号 |
F28F7/00;B32B5/18;C08J9/00;C08J9/06;C08J9/12;C08J9/16;C09J5/08;C09J7/00;C09J7/02;C09J11/04 |
主分类号 |
F28F7/00 |
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