CARRIER HEAD STRUCTURE FOR POLISHING APPARATUS OF SILICON BARE WAFERS

摘要

PURPOSE: A carrier head for a silicon bare wafer polishing device is provided to uniformly polish the entire silicon bare wafer by independently controlling pressure to the silicon bare wafer through the elastic rubber body of a pressing plate. CONSTITUTION: A grinding pad(700) polishes a silicon bare wafer. A carrier head housing is combined with the adaptor of a shaft in order to be arranged in parallel to the surface of the grinding pad. A retainer ring(200) supports the wafer not to be separated from the carrier head housing. A pressing plate(300) is combined with the lower center of a carrier head housing body part in order to be independently and vertically transferred with the retainer ring. An elastic rubber body is fixed to the lower surface of the pressing plate. The rubber body absorbs and supports the silicon bare wafer.