| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a physical quantity detection device not generating a crack on a soldered part of an electrode even when receiving a heat cycle, which is caused by a difference of a coefficient of linear expansion between a ceramic package having a built-in sensor and a substrate on which the package is mounted. <P>SOLUTION: When mounting by soldering the ceramic package having a detection element, mounting can be performed through a relay substrate. The relay substrate is provided with a package loading part including a terminal electrode connected to a terminal of the ceramic package, and with a projection part projecting in the extending direction of the relay substrate surface. The projection part is provided with an external electrode to be connected to the package loading part, and soldering is performed on the mounting substrate through the external electrode. A constriction part is provided in the middle of the projection part, to thereby facilitate elastic deformation, and a change by thermal expansion/contraction can be absorbed, to thereby suppress generation of a solder crack. In this case, a substrate whose coefficient of linear expansion is smaller than that of the mounting substrate and larger than that of the ceramic package is used as the relay substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
