| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate having surface connection terminals with the superior reliability of connection with a chip component. <P>SOLUTION: The multilayer wiring substrate 11 has a laminated structure 40 composed of conductor layers 51 and resin insulating layers 43 to 46 stacked alternately. A plurality of surface connection terminals 30 to which terminals 22 of the chip component 21 are to be surface-connected are formed on a main face 41 of the laminated structure 40. A plurality of via conductors 57 connected to the plurality of surface connection terminals 30 are formed in the resin insulating layers 46. Each of the plurality of surface connection terminals 30 has a structure in which a copper layer 31, a nickel layer 32, and a gold layer 33 are stacked in this sequence. The gold layer 33 is larger in diameter than at least the copper layer 31. The gold layer 33 has an overhanging portion 33a which extends radially outward from a circumference of the copper layer 31. <P>COPYRIGHT: (C)2010,JPO&INPIT |
