METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible metal-wiring board having high adhesion strength between a polymer film and a metal foil to make the board suitable for forming high-definition patterns and for high frequency use. SOLUTION: A metal oxide is formed on a polymer film to a thickness of≤1μm before forming a metal foil; a metal thin film is deposited thereon to a thickness of 1μm or less using an electrically conductive metal as the deposition source; and the metal film is formed thereon by electroplating to a thickness of≥1μm and≤30μm. A film base member for a wiring board whose adhesiveness between the resin film and the metal film is enhanced, is thereby formed. COPYRIGHT: (C)2010,JPO&INPIT