发明名称 METHOD OF PROCESSING SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of processing a semiconductor substrate that can easily increase the surface area of a surface to be processed of the semiconductor substrate. SOLUTION: The method of processing the semiconductor substrate processes the surface of the semiconductor substrate 10 constituting a solar cell, includes a semiconductor substrate holding process of holding the semiconductor substrate on a holding surface of a chuck table 62 with the surface to be processed up, a grinding wheel positioning process of setting a grinding surface of a grindstone constituting a grinding wheel of a grinding means at a grinding position a predetermined amount below the surface to be processed of the semiconductor substrate held on the chuck table, and a grinding process of forming striped unevenness on the surface to be processed of the semiconductor substrate by causing a juddering phenomenon by moving the chuck table at a predetermined processing feed speed in a state wherein the grinding wheel is rotated and causing the grindstone to act on the semiconductor substrate held on the chuck table from one end to the other end of the semiconductor substrate. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010192640(A) 申请公布日期 2010.09.02
申请号 JP20090034932 申请日期 2009.02.18
申请人 DISCO ABRASIVE SYST LTD 发明人 MASUDA TAKATOSHI;HARADA SHIGEKI
分类号 H01L21/304;B24B7/22 主分类号 H01L21/304
代理机构 代理人
主权项
地址