发明名称 Resin Molding Apparatus and Resin Molding Process
摘要 Conventional production of plastic products not releasing harmful organic molecules requires a high injection or extrusion pressure in order to avoid heating of a resin to high temperature, resulting in use of a large-sized and heavy resin molding apparatus having high electric power consumption. The employment of a method of inhibiting oxidative decomposition and catalytic decomposition enables the formation of a molten plastic having an extremely low viscosity without decomposition or dissociation even at high temperature, whereby the molding of the resin can be conducted at a very low injection or extrusion pressure to attain the downsizing and weight saving of the resin molding apparatus.
申请公布号 US2010219564(A1) 申请公布日期 2010.09.02
申请号 US20050991800 申请日期 2005.09.12
申请人 OHMI TADAHIRO 发明人 OHMI TADAHIRO
分类号 B29C45/00;B29C47/00;H05B6/00 主分类号 B29C45/00
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