发明名称 METHOD FOR MAKING AN ELECTRIC INTERCONNECTION BETWEEN TWO CONDUCTING LAYERS
摘要 This method for making an electric interconnection between two conducting layers separated by at least one insulation or semi-conducting layer, comprises forming a stud extending at least between the lower conducting layer and the upper conducting layer, wherein the nature and/or the shape of said stud impart non-wettability properties relative to the material used for the separating layer.
申请公布号 US2010221909(A1) 申请公布日期 2010.09.02
申请号 US20100775717 申请日期 2010.05.07
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES 发明人 VERILHAC JEAN-MARIE;BABLET JACQUELINE;BORY CECILE
分类号 H01L21/768;B05D3/04;B05D3/06;B05D5/12 主分类号 H01L21/768
代理机构 代理人
主权项
地址
您可能感兴趣的专利