发明名称 |
PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO-CONTROLLED CLOCK |
摘要 |
<p>Provided is a package manufacturing method by which an electronic component can be packaged in a cavity formed between a plurality of substrates bonded to each other. The method has a through electrode forming step of forming a through electrode, which penetrates a first substrate among the substrates in the thickness direction and permits a current to be carried between the inside of the cavity and the outside of the package. The through electrode forming step has a through hole forming step of forming a through hole on the first substrate for arranging the through electrode, and a filling step of filling the through hole with a filling material under depressurized atmosphere.</p> |
申请公布号 |
WO2010097905(A1) |
申请公布日期 |
2010.09.02 |
申请号 |
WO2009JP53334 |
申请日期 |
2009.02.25 |
申请人 |
SEIKO INSTRUMENTS INC.;FUNABIKI, YOICHI;NUMATA, MASASHI;SUGAMA, KAZUYOSHI |
发明人 |
FUNABIKI, YOICHI;NUMATA, MASASHI;SUGAMA, KAZUYOSHI |
分类号 |
H03H3/02;H03H9/02;H03H9/19;H03H9/21;H03H9/215 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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